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Biography 2

Dr. Boey
Kok Heong

Founder and Managing Director
Dr. Boey is a distinguished figure in mechanical and manufacturing engineering with over 20 years of experience. As the Managing Director of Solid Precision Engineering and Solid Integrations, he has led advancements in industrial automation and precision technologies, earning prestigious recognitions like the Malaysian Top 50 SME Award (2022).
“Advancing smart manufacturing and bridging the gap between industry needs and academic preparation.”
Dr. Boey's Philosophy

Facts

Education

Bachelor of Engineering (Hons) in Mechanical Engineering from Universiti Sains Malaysia; Doctor of Engineering in Manufacturing Engineering from Universiti Teknikal Malaysia Melaka.

Industry Roles

Managing Director of Solid Precision Engineering Sdn. Bhd. and Solid Integrations Sdn. Bhd.; Director of MYS Conversions Sdn. Bhd..

Academic Contribution

Associate Research Fellow (Industry) at Universiti Teknikal Malaysia Melaka; Advisor for Universiti Sains Malaysia and Politeknik Tuanku Sultanah Bahiyah..

Qualifications

  • Registered Professional Technologist (MBOT)
  • Former EXCO member of Malaysia Inventions and Design Society (MINDS)
  • Life Member of MINDS

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Biography

Lim
Yee Kee

Biography

Mr. Lim Yew Kee is a registered Chartered Engineer (CEng) with the Engineering Council (EC-UK), United Kingdom. He is currently a Engineering Consultant based in Penang, Malaysia. Other than the involvement in industry, he is also the Industry-Community Advisory Panel (ICAP) at Universiti Sains Malaysia (USM); and the adjunct lecturer in Universiti Teknologi PETRONAS (UTP), Tronoh, Perak

“Keep moving forward and never stop.”
Nioh’s Philosophy

Professional Society

Mr. Lim has been actively serving the Institution of Engineering and Technology (IET), United Kingdom since 2013. He is elected as the Council Member. He has been selected as the IET Ambassador for IET China (2016). Currently, he is the International Professional Registration Advisor, IPRA (since 2017-present) for Chartered Engineer (CEng) and Incorporated Engineer (IEng), as well as the Chairman (2018-2020) of IET Internet of Things Network.

In short, the profession and vast experience in the industry and academia of Mr. Lim are worth to be shared and learned by many.

 Mr. Lim Yew Kee has been invited to deliver technical lectures to various universities and professional societies in China , India, Singapore and other countries.

Talk Synopsis

This technical talk entitled “Smart Manufacturing” is to make awareness for participants to understand the resources about the Internet of Things (IoT) equipment used and the perceptions of IoT its potential applications to optimize production and enabling manufacturing efficiency.


Book Your
Slot Now

Registration & Full Paper Submission from 1st Mac 2026.

Join Now

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Paper Submission

PAPER SUBMISSION

The organizing committee of ICRAIEM 2026 would like to invite all industrial players, academicians, researchers, engineers, scientists and others to submit their  full-papers to ICRAIEM2026 online using  full paper templates provided in the link given below. We welcome papers related to all aspects of Industrial Engineering and Manufacturing.
Full papers should be within six (6) to twelve (12) printed pages including figures and references following the format given in the template.

Full paper submissions will be due on 15th October 2026. 

*Accepted paper will be published in Scopus journal/proceeding.

FULL PAPER GUIDELINE AND TEMPLATE

Click here for templates and guidelines for preparing your paper. Copyright will be retained by the individual authors. Nevertheless, the publication is bound to terms set out in "The Proceedings Publication License" (a general publication regulation including plagiarism, inappropriate content etc.). The publisher has the right to reject the paper.

SUBMISSION PROCESS

Submission of full paper can be made via EZ Conference Management System or follow the QR code.

qrcode 324825153 ae447efcf3eba4ee8fa700fab696f244

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Venue

VENUE

  • Spice 7

  • Spice 4

  • Spice 2

ICRAIEM 2026 will be hosted at Setia Spice Arena, Penang, one of Malaysia’s most vibrant and sought-after destinations. Known as the Pearl of the Orient, Penang offers a captivating blend of rich history, stunning white sandy beaches, and unique cultural experiences. From heritage streets to bustling markets and world-class cuisine, it is truly Malaysia’s melting pot—making it the perfect backdrop for an inspiring and memorable conference.

ACCOMMODATION

Walking Distance  

  1. Amari SPICE Penang — ★★★★★ 
    📍 Address: 2, Persiaran Mahsuri, 11950 Bayan Lepas, Penang, Malaysia 
    🌐 Website: https://www.amari.com/penang 
  2. Olive Tree Hotel Penang — ★★★★ 
    📍 Address: No. 76, Jalan Mahsuri, 11950 Bayan Lepas, Penang, Malaysia 
    🌐 Website: https://www.olivetree.my/  

Short Drive (5–15 min from SPICE) 

  1. AC Hotel by Marriott Penang — ★★★★ 
    📍 Address: 213, Jalan Bukit Gambir, 11950 Bayan Lepas, Penang, Malaysia 
    🌐 Website: https://www.marriott.com/hotels/travel/penar-ac-hotel-penang/ 
  2. Eastin Hotel Penang — ★★★★ 
    📍 Address: 1, Solok Bayan Indah, Queensbay, 11900 Bayan Lepas, Penang, Malaysia 
    🌐 Website: https://eastin.com/penang 

Nearby Suites, Apartments & Budget Picks 

  1. Lexis Suites Penang — ★★★★+ 
    📍 Address: 28, Jalan Teluk Kumbar, 11920 Bayan Lepas, Penang, Malaysia 
    🌐 Website: https://lexissuitespenang.com 
  2. The Corum View Hotel — ★★★ 
    📍 Address: 33, Jalan Tun Dr Awang, 11900 Bayan Lepas, Penang, Malaysia 
    🌐 Website: https://thecorumviewhotel.hotelspenang365.com/en/ 
  3. Hotel Seri Malaysia Penang — ★★★ 
    📍 Address: Jalan Sultan Azlan Shah, 11900 Bayan Lepas, Penang, Malaysia 
    🌐 Website: https://serimalaysia.com.my/hotel-seri-malaysia-pulau-pinang/ 
  4. U Hotel Penang (Bayan Lepas) — ★★★ 
    📍 Address: Jalan Tengah, 11900 Bayan Lepas, Penang, Malaysia 
    🌐 Website: https://uhotelpenang.com/ 

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Sponsorship

SPONSORSHIP

ICRAIEM Sponsorship brochure front page

INVITATION TO SPONSORSHIP

Your sponsorship will play a vital role in ensuring the success of the Conference, while simultaneously contributing to the advancement of Smart Manufacturing through artificial intelligence–driven solutions and sustainable engineering innovations. The Conference will provide a stimulating and inclusive forum for scientists, engineers, educators, researchers, manufacturers, and scholars from around the world to present their latest research findings and exchange knowledge on emerging topics in manufacturing and industrial engineering. The full range of benefits or entitlement for various levels of sponsorships is indicated in the attached Sponsorship Package Form.

WHY SPONSORS?

  • ICRAIEM 2026 offers prospective sponsors recognition as an industry leader.
  • ICRAIEM 2026 is an excellent platform to market your latest services, products and developments.
  • ICRAIEM 2026 is an excellent event to build up new and existing partnerships with stakeholders and a part of corporate social responsibility in supporting educational activities.

Be a sponsor of ICRAIEM 2026 and get a superior leverage and your presence recognized by attendees.

SPONSORSHIP PACKAGE

ICRAIEM2026 MAIN SPONSORSHIP

1. Act as co-sponsor of the ICRAIEM conference

Type of Sponsorship

Benefits

Amount Sponsored

Platinum

  • ONE (1) exhibition booth for two days including TWO (2) exhibitor passes (inclusive tea breaks and lunch).
  • Company logo in the conference book (front cover), banner, and website.
  • Complementary conference access for TWO (2) pax.
  • Complementary conference dinner for TWO (2) pax.
  • Promotional material to be included in conference bag.

RM 10,000.00

Gold

  • Company logo in the conference book (front cover), banner, and website.
  • Complementary conference access for TWO (2) pax.
  • Complementary conference dinner for TWO (2) pax.
  • Promotional material to be included in conference bag.

RM 5,000.00

Silver

  • Company logo in the conference book (front cover) and banner.
  • Complementary conference dinner for TWO (2) pax.
  • Promotional material to be included in conference bag.

RM 3,000.00

ICRAIEM2026 OTHER SPONSORSHIP PACKAGES 

2. Advertisement for products/services in the ICRAIEM conference book

  • Back cover outside (Full page) RM 3,000.00
  • Back cover inside (Full page) RM 1,500.00
  • Full page advertisement RM 1,000.00

3. Company logo on the ICRAIEM conference website

  • Company logo & link to company website RM 500.00

4. Exhibition booth (limited to 5 booths only)

  • ONE (1) exhibition booth for two days including TWO (2) exhibitor passes (inclusive tea breaks and lunch) RM 3,000.00

5. Sponsorship in kind (sponsor’s logo will be printed on items)

  • Conference bags RM 3,000.00
  • USB flash drives  RM 1,000.00
  • Other kinds can be specified by the company

Click here imageICRAIEM2026 Sponsorship Brochure

HOW TO SPONSOR

We look forward to your favorable response and to welcoming you as our partner. Kindly complete the following sponsorship reply form at your convenience:

Click here imageSponsorship Reply Form

All sponsorship payments may be made to Bendahari Universiti Sains Malaysia via:
Bank Islam Malaysia Berhad (Account No.: 08022010067243)

Please return the completed sponsorship reply form and proof of payment to This email address is being protected from spambots. You need JavaScript enabled to view it.. Should you require any further information or clarification, please do not hesitate to contact us at the details below:

Assoc. Prof. Ir. Dr. Yen Kin Sam (This email address is being protected from spambots. You need JavaScript enabled to view it.)
Assoc. Prof. Dr. Loh Wei Ping (This email address is being protected from spambots. You need JavaScript enabled to view it.)

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